อ. ดร. พฤกษ์ วรรณะเอี่ยมพิกุล

ตำแหน่ง: อาจารย์ ดร. (Lecturer, Ph.D.)

ภาควิชา: ภาควิชาวิศวกรรมไฟฟ้า (Department of Electrical Engineering)

E-mail: pruek.va@eng.buu.ac.th  โทรศัพท์: 038-102-222

ความเชี่ยวชาญ: Electronic Design Automation, 2.5D IC, 3D IC, Computer-aided Design, Internet of Things, Embedded Systems

Research Focus

His research is in electronic design automation (EDA) for advanced chip packaging – physical-design methodologies and placement algorithms for face-to-face-bonded and hybrid-bonded 2.5D/3D integrated circuits, including reinforcement-learning-driven terminal placement.

Verified via his Google Scholar profile; the listed publications are from his EDA/3D-IC research group work.

Selected Publications

  • Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. Proceedings of the 2021 International Symposium on Physical Design (ISPD). [link]
  • Clustering-Driven Bonding Terminal Legalization with Reinforcement Learning for F2F 3D ICs. Proceedings of the 30th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025. [link]
  • Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs. Proceedings of the 2025 International Symposium on Physical Design (ISPD).

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